Atlanta area or Intl: 770.491.1131 US Toll Free: 1.800.959.3525


Extreme Energy Savings - Managed exhaust eliminates the need for re-cooling of the heat generated by the cluster, and the wide operating temperature margin allows for operation in a hotter ambient environment

Extreme Integration - Advanced cabinet and high-density Beowulf cluster node design with all-inclusive mounting, cabling, and cooling solutions.

Extreme Density - 3.6 times as many AMD Athlon ™, or Intel Xeon ™ based Beowulf cluster nodes in a room as with as standard rack. Click here for detailed information on the density of the Clusteron...

Extreme Performance - Utilize highest speed dual AMD Athlon ™, or Intel Xeon ™ processor nodes at FULL LOAD 24/7.

Extreme Cooling - Hexa-Side ™ cabinet cooling and Quadra-Side ™ node cooling provide a wide operating temperature margin for optimum reliability of the AMD Athlon ™, or Intel Xeon ™ processors and the overall system. A neccesity for a high-density solution.

The high-density Beowulf cluster nodes featured in this website have been optimized for dual AMD Athlon ™, and Intel Xeon ™ processor based Beowulf clustering configurations.






• Patent pending Hexa-Side™ cabinet cooling technology
• Patent pending Quadra-Side™ chassis cooling technology
• Integrated air filtration front and bottom
• Warm air exhaust via right side, rear and top of cabinet.
• Forced air flow through the cabinet prevents high temperature saturation
• Air dampers for each chassis maintain proper airflow when a node is removed
• Integrated electrical load center
• Integrated circuit breaker power distribution
• Integrated cable management system
• Integrated cabinet top wire trough
• Cabinet top or bottom cable routing
• Integrated remote power monitoring module optional
• Integrated remote temperature monitoring module optional
• Integrated remote system management optional
• Integrated chassis slide mounts provided as standard equipment
• Most technologically advanced cabinet on the market
• Casters and leveling feet supplied as standard equipment
• Ventilated locking front door as standard equipment
• 24”W x 29”D cabinet footprint
• 19”W x 18”D node footprint
• Dual Intel Xeon™ systems 2.8GHz and beyond
• Dual AMD Athlon™ systems 2200MP and beyond

5 Standard racks in a 10' by 14' room.

18 CCSI Clusteron™ racks in the same 10' by 14' room. 3.6x times as many in the same space!


Atlanta area or Intl: 770.491.1131 US Toll Free: 1.800.959.3525
The CCSI Clusteron Cabinet

The CCSI Clusteron™ Cabinet has been designed to be the perfect cabinet for high performance clustering applications. Utilizing CCSI Hexa-Side™ cooling, the CCSI Clusteron™ cabinet actively participates in maintaining the optimum performance temperature of your Clusteron™ appliance. You won't find a more technologically advanced rack cabinet anywhere. The question we're most often asked is "does the cabinet really make that much difference?" and our answer is always yes. Inproper airflow within a rack cabinet can render chassis airflow useless. The CCSI Clusteron™ cabinet insures a constant supply of cool, fresh air to your rack mounted CCSI Clusteron™ units. Combine the Clusteron™ cabinet and the Clusteron™ 1U rack mounted cluster server and you have the most high performance, reliable cluster appliance on the market.

A unique automatic air damper system reroutes air flow when a node is removed, so that air flow does not short-circuit, but still flows through each node, providing adequate cooling, regardless of how many nodes are present in the cabinet. This is crucial in real-world conditions where a node may be removed for service, and without the Clusteron™ air dampers, the remaining nodes could overheat. and would otherwise disrupt air flow through.

Air filtration is optionally available for both the bottom and front door.

Built-in slide shelf chassis mounting system includes the automatic air dampers, and eliminates the cost and adjustment problems associated with slide rail mounting systems.

Built-in load center and power distribution provides circuit breaker protection, and access, right in the Clusteron™ cabinet, rather than a remote panelboard. A single power connection is all that is necessary.

Cable management provisions make it possible to route cables safely and neatly out of the way. Knock-outs on the Clusteron™ cabinet sides and back enable safe cable routing between cabinets.

Front door is perforated for air flow, and features a heavy duty lock

Holds up to 36 nodes in one 24" by 24" cabinet, or 82 nodes, in 2 cabinets mounted back to back. A Clusteron™ holding up to 36 nodes, (or 72 mounted back to back) will roll through a standard 6' 8" doorway.

Front access design allows Clusteron™ to be mounted against a wall, and combined with the shallow depth, it allows 2 Clusterons to be mounted back to back, to form a 24" by 48" unit.

Has heavy duty casters for easy relocation.

Has powder coat paint to resist nicks and scratches.

Is all heavy duty Steel, "dual hull" construction provides exceptional rigidity as well as forming air tunnels and providing cable routing.

Features CCSI's Hexa-Side™ flow through cooling technology. Air is drawn in from the bottom and front, and ducted through air tunnels to the front and left sides of each node. The air is exhausted from the right side and rear of each node, and ducted through air tunnels to the top of the Clusteron™.

Hot exhaust air can be ducted directly into the building return air plenum from the Clusteron™ ventilation system, removing all of the heat load from the server room


Atlanta area or Intl: 770.491.1131 US Toll Free: 1.800.959.3525


The Clusteron rack enclosure brings the necessary fresh outside air to each chassis, and carries the heated air away, so that it cannot short-circuit back through another chassis. Fresh cool air enters the rack through the bottom and front. It is ducted to the front and left side of each chassis, and metered into the chassis. The hot air from the rear and right side of each chassis is sucked out and ducted up through the top of the enclosure, where it can then be removed from the room. The Clusteron is the only rack enclosure that ducts all incoming and exhaust air, and prevents them from mixing.

This is an animated diagram visualizing the airflow within the Clusteron cabinet. Blue arrows show cool air, the red, hot air. The right angle arrows represent the flow in and out of the individual Clusteron nodes. The straight arrows represent the airflow within the cabinet itself.

In the Clusteron, the design of the individual chassis is integrated with the design of the rack enclosure to work together to provide the cooling solution. In each chassis, fresh cool air is sucked in through the front and left side, and ducted directly to the CPU's by a CCSI Wind Tunnel. Two blowers, with static pressure much higher than a fan, provide the force necessary to move the air through the sidewall resistance. The power supply is also cooled with fresh air from outside the chassis. The heated air from both the CPU's and the power supply is exhausted out the right side and rear of the chassis. This ensures that heated air is not blown back over a CPU. In this Quadra-Side cooling solution, air flow is directed through the chassis to ensure that hot components are always cooled by fresh air from outside the chassis.


As a self-protection feature, some Intel CPU's incorporate internal temperature monitoring and a throttling circuit. This thermally controlled governor will reduce speed to prevent the CPU from overheating, and thus provides for a stable system even when built into a chassis that is not thermally correct. The flip side, however, is that the governor limits the performance by automatically lowering the CPU speed. You don't get the performance that you paid for, and, what's worse, you have no way of knowing how much your system performance has been degraded. Tests and observations may show the server running perfectly, while it is actually only walking, or even crawling.

CCSI assembled a task force of engineering experts to solve these thermal obstacles and build "future proof" thermally correct high-density, high performance servers. The goal was to provide adequate cooling, not only for today's processor speeds, but also for the 3 and 4 GHz. Processors we will have soon, and even for new processor designs such as the AMD Opteron. The result of this research is the CCSI Clusteron.

In most server installations, the air heated by the high speed CPU's must then be cooled by huge air conditioners. The cost of the air conditioning is substantial, and the cost of backup power to run the air conditioning through a power failure is even greater. Recirculating the same air, and cooling it, is an expensive proposition. With the Clusteron, the hot air can be exhausted from the room, and fresh outdoor air brought in, instead of cooling the same air. The outside air requires little or no cooling, and no backup power is required for the air conditioning system. What a cost savings! Also, the heated air exhausted from the Clusteron can be salvaged, possibly to heat other buildings. The greatest savings of all, though, is in the increased reliability of Clusteron installations. High quality computers are far more reliable than air conditioners, so when the functioning of a computer depends on the proper functioning of an air conditioning system, overall reliability is unavoidably compromised. And that costs money.


CCSI's Clusteron™ Cooling Technology

'The Challenge'
CCSI's Clusteron represents a breakthrough in cooling technology for high density rack mounted servers. The Clusteron carries cool, fresh, outside air directly to each CPU, rather than recirculating warm air within the enclosure. This ensures thermally correct cooling of each CPU, and permits high density installations to operate at maximum speed 24/7. In today's high power, high density servers, the cooling is the technology that makes the difference.

In legacy tower server chassis and in low-density rack chassis installations, there was ample real estate in the front and rear and on the sides of the chassis for mounting intake and exhaust fans. In 1U enclosures, however, there is just not enough wall space to bring in adequate cooling air, just using fans, to offset the heat produced by 2 high speed CPU's. When more fans are added, they just recirculate the warm air within the enclosure, so their ability to cool the CPU is limited. Add it up:

Ambient air temperature 95° (outdoors on a summer day) + Offset based on heat transfer ability 60° (typically - depends on fan) = Total CPU operating temperature 155°

The CPU "absolute maximum" temperature ratings are typically 185°. If recirculated air is used for CPU cooling, and it has already been heated to 130°, then the equation becomes 130° ambient + 60° offset = 190° - and the CPU will be damaged or destroyed. Every degree rise in intake air temperature to the CPU cooler directly translates into a corresponding rise in the CPU junction temperature. Recirculated air cannot adequately cool the CPU's in a 1U or even 2U rack mounted enclosure.


©Copyright 2003 CCSI (Computer & Control Solutions, Inc)